The packaging for Intel’s Core i9-13900K processor has been leaked, and whereas the spilled picture exhibits that it follows the identical theme as the present 12900K – together with that wafer – there are some slight, however nonetheless attention-grabbing, modifications.
The field for the Core i9-13900K was posted on Twitter by well-known leaker HXL, who obtained it from a closed WeChat group, as VideoCardz (opens in new tab) factors out (and naturally, keep skeptical round whether or not that is real or not, as ever).
i9k（Thirteenth） PackagingSource: WeChat pic.twitter.com/ffQIf2KSZ1September 23, 2022
As you possibly can see, there are some notable modifications right here, and whereas Intel has nonetheless put the processor in a elaborate mock silicon wafer case, this time round, moderately than gold, it’s coloured silver.
Moreover, the field itself is rather a lot thinner than the one which carries the current-gen Alder Lake flagship, though in any other case, the design stays fairly comparable.
Evaluation: Raptor Lake leaks are gathering momentum, for positive
What’s most attention-grabbing right here, in fact, is the truth that getting a glimpse of the field of the Raptor Lake flagship signifies that possibly Intel’s next-gen chips aren’t too distant from launch now. Significantly as we simply noticed the Core i9-13900K in leaked PassMark benchmarks, so the spillage round these Thirteenth-gen processors seems to be selecting up momentum.
Rumor has it that Raptor Lake CPUs might be launched subsequent week, doubtless on September 27, however the silicon won’t go on sale until October. These leaks beginning to pop up increasingly proper now’s a hopeful indication that we would simply see these processors sooner in October, moderately than later.
So far as the packaging itself goes, altering from a gold wafer to silver appears an odd selection for Intel, suggesting one thing of a downgrade, not less than subliminally. You get a silver medal for second place, in spite of everything, and gold for the highest spot. It’s good to see a slimmer field when it comes to preserving issues a bit extra environmentally-friendly, as nicely; though that stated, the extra wafer packaging is moderately pointless, and never so ecologically sound in that respect.
We’ve a sense that the wafer gimmick is getting its final outing right here, and it might make sense for Intel to do an entire field redesign for the following era of processors in 2023, which might be Meteor Lake (as this might be an enormous change with the drop to 7nm, lastly).